Electronic cooling simulations using ANSYS ICEPAK

Rs 30,000(3 month EMI available)

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ANSYS Icepak is a powerful CAE software tool that allows engineers to model electronic system designs, perform heat transfer and fluid flow simulations.Icepak combines advanced solver technology with robust, automatic meshing to help you rapidly perform heat transfer and fluid flow simulation for a wide variety of electronic applications — including computers, telecommunications equipment and semiconductor devices, as well as aerospace,automotive and consumer electronics.

Note: Official software is not included in the price of the course


Top 5% of the class will get a merit certificate. Course completion certificate will be provided to all students who complete the course. You will receive both e-verified and hard copy of your certificates.


Week 1 : Introduction to Electronics cooling

This session gives you basic understanding of heat transfer in electrical and electronics cooling.

  • Thermal problems and challenges in electrical and electronics
  • When to do thermal analysis
  • Basics of heat transfer in electronics
  • Analogy - Electrical Vs. Thermal
  • Thermal Resistance and Capacitance
  • Thermal management at different level – Component/Chip/Package level, Board level and System level
  • Different components in electronics
  • Process of solving thermal issue using Icepak
  • Most influential factors in thermal management of electronics
  • Overview of Ansys Icepak (Software introduction)

Week 2 : Icepak Model Building

This course help you to build thermal model of electronic device using Icepak primitive shapes.

  • Thermal Simulation approach
  • Different Primitives and compound objects in Icepak with their uses in thermal model
  • Building the first project in Icepak
  • Geometry creation using Icepak to capture geometric information, material properties, and boundary conditions
  • Priorities of objects
  • Setting up the first problem
  • Meshing
  • Solving the first problem
  • Checking the convergence
  • Post processing and interpretation of results

    Week 3 : Meshing Techniques

    In this module of the course, you will learn more on meshing the created geometry and use of different meshing techniques. Upon completion of this module, students will be able to do the following:

    • Conformal Meshing
    • Non- Conformal meshing
    • Cold-Plate Model with Non-Conformal Meshing
    • Zero slack with Non Conformal meshing
    • Multi-level meshing
    • Mesh and Model Enhancement Exercise
    • Global Refinement for a Hex-Dominant Mesh
    • Best practices for meshing complex geometries
    • Hands-on meshing examples and Home works

    Week 4 : Natural Convection

    In this module, students will learn how to simulate natural convection problems. Some of the topics covered in this module include:

    • Basics of natural convections
    • Basics of buoyancy effect
    • Design of thermal system for best use of natural convections
    • Compare design alternatives

    Week 5 : Forced convection

    In this module, students will learn how to simulate forced convection problems. Some of the topics covered in this module include:

    • Basics of forced convections
    • Uses of Heat Sink
    • Understand Heat pipes Modeling and Nested Non-Conformal Meshing
    • Choose a pump, fan, fluid mover to perform adequate fluid flow rate
    • Hands-on examples and homework

    Week 6  : Heat generation

    Upon completion of this lecture, students will be able to

    • Analyze heat generation due to Joule heating in electronic and electrical device
    • PCB Modelling: Compact and detailed modelling
    • Analyze Trace heating in PCB in electronics
    • Perform Board-Level Electrothermal Coupling
    • Hands-on examples and homework

    Week 7 : CAD Imports

    Icepak has the capability to import geometries from various CAD softwares, In this module students will understand

    • CAD and ECAD import options within Icepak
    • Design modeller / Spaceclaim
    • Translation of MCAD Geometry to Icepak Native Geometry
    • Hands-on examples and homework

    Week 8 : Radiation modelling

    Radiation modelling is an important phenomenon in electronics cooling. Upon completing this module, students will be able to comprehend

    • When to include radiation model (T^4)
    • Different radiation models in Icepak
    • User input Properties and parameters
    • Solar radiation / Flux calculator
    • Hands-on examples and homework

    Week 9 : Post processing

    Understand how to utilize ANSYS Icepak to obtain useful post processing results.

    • Vector plots
    • Streamlines
    • Contours
    • Section planes
    • Various post processing methods and plots
    • Reporting results
    • Hands-on examples and homework

    Week 10 : Advanced Simulations

    In this lecture, students will be able to use Icepak to solve some of the advanced and complex problems.

    • Analyze transient simulations
    • Understand Zoom-In Modeling approach in Icepak
    • Use of advanced methods in projects
    • Hands-on examples and homework

    Week 11 : Macros

    Macros are used to fast-build Icepak model. In this Session, you will learn to use some of the macros available in Icepak. Productivity macros are useful for model validation and performing routine tasks: automatic meshing, find zero-slack assemblies, copy assembly mesh settings, debug diverence, delete unused materials / parameters, and so on.

    • JEDEC Test Chambers - Natural convection and forced convection
    • PCB
    • Detailed heat sink
    • Data center components
    • Create bonding wires

    Week 12 : Optimization  

    In this lecture you will be able to use Icepak dynamic-Q optimization method to solve design optimization problems. Such problems occur frequently in engineering applications where time consuming numerical simulations may be used for function evaluations. By the end of this module, you will be able to comprehend

    • When to use optimization
    • Defining design variables and a parametric study in Icepak
    • Setting up & running trials
    • Define Parametric Runs and Assign Primary Functions
    • Function reporting and plotting  


    1. Who can take your course?

    This course is for the engineering students (BE, BTech and MTech) or passed out students and professionals who have little to no experience in electronics cooling simulations with Ansys Icepak. The prerequisite for this course requires knowledge in heat transfer and fluid dynamics. Students should have access to Ansys Icepak.

    2. What is included in this course?

    This course includes basics of heat transfer in electrical and electronics and methods to solve any thermal problem using ANSYS Icepak. Students will be introduced to electronics thermal modeling through lectures and tutorials. The course provides plenty of hands-on work to learners through the entire simulation process.

    3. What will the student gain from your course?

    The course covers several phases ranging from understanding the physics of problem, thoughts on simulation method, geometry model building of electronic part, meshing of geometry, problem setup and boundary conditions, solution, results and visualization to quantitative postprocessing.

    4. What software skills are you teaching and how well are these tools used in the industry?

    Ansys Icepak - This is one of the most used simulation tool in the electrical and electronic industry to solve thermal related problems

    5. What is the real world application for the tools and techniques will you teach in this course?

    Some of the real world applications of what we cover in this course include: Thermal simulation of Heat generation in electrical components due to joule losses. PCB thermal simulations, Force and natural convections, conduction and radiation.

    6. Which companies use these techniques and for what?

    Some of the popular companies that uses these tools include Schneider Electric, Cisco, Apple, Altair, L&T, NVIDIA, Intel, ABB, Philips etc.

    7. How is your course going to help me in my path to MS or PhD?

    Future is digitization, electronic products are getting compact and thermal management is getting tougher. So candidates with these competencies have more scope in MS or PhD.

    8. How is this course going to help me get a job?

    If you are thermal analyst or you want to be, then with these competencies you will have more demand in electrical and electronic industries. An expert in thermal simulation will definitely secure the job as there are very few experts available in the market.